Samsung is developing a new cooling solution for future Exynos smartphone processors, inspired by PC and server heatsinks. The technology, known as fan-out wafer-level package-HPB (FOWLP-HPB), involves attaching a heat path block (HPB) to the top of the chipset. Expected to be ready by Q4 2024, this could potentially be used in the Exynos 2500. This innovation comes after the Exynos 2400 ran hotter than the Snapdragon 8 Gen 3, prompting the need for better cooling solutions. The goal is to improve performance, battery life, and reduce heat in future Exynos chips. This new development is crucial for Samsung's upcoming models like the Galaxy S25, providing a more consistent and efficient chipset. Email us at news@androidauthority.com with any tips or information.